Product Application
Product Application
UV Debonding Film
Designed for the development of processes such as flipping, stacking, cutting, and grinding in the semiconductor, substrate, and optoelectronics industries.
Can be temporarily fixed during the process and easily peeled off without leaving any residue after UV irradiation.
Product Features
- Special adhesive formula has good initial adhesion and does not scatter during the process or cutting.
- UV curing can be processed at low temperature, with minimal heat damage and rapid reaction time, which can improve production efficiency.
- The coating thickness can be designed according to custom requirements (15-200um). Thick adhesive products can also be debonded in a short time without leaving any residue.
Product Composition
Single sided-UV debonding tape
Double-sided UV debonding tape
Product Specification
| Product Type | Normal temperature series | Heat-resistant series | ||
| Product Name | PET25UH20-5 | PET75UH160-5 | PET25UH20-5 | |
| Base film thickness | 25 um | 75 um | 50 um | |
| Adhesive layer thickness (μm) | 20 um | 160 um | 20 um | |
| Liner thickness | 19 um | 75 um | 19 um | |
Initial adhesion at room temperature | UV前 | 910
| 620 | 1150 |
| UV 1000mj | 5 | 15 | 12 | |
High-temperature adhesion | 150°C-1hr | – | – | 20 |
| 240°C-10mins | ||||
| UV 1000mj | ||||
Inquiries on This Product
ZACROS Taiwan Sales Dep.
Tel：07-6955966 #2150~2159