Product Application

Product Application

5G-related Material

In recent years, the fifth-generation mobile communication system (5G) has received significant attention. This is due to being able to achieve communication speeds that are 5 to 10 times faster than traditional systems by using high-frequency millimeter waves.

With the advent of 5G’s high-capacity, high-speed communication, various materials are currently being developed to achieve the implementation of a smart society, represented by self-driving cars and remote medical care.

Product Description

Low-dielectric adhesive copper foil: ZAC-LDC

A resin coating with low transmission loss/thermosetting adhesive is applied on a low-profile copper foil. This greatly contributes to improving the performance of 5G wiring boards.

Product Features

  1. Uses low-profile copper foil
    – The resin is designed to maintain good adhesion even when using low-profile copper foil.
  2. Easy lamination
    – Due to the adhesive resin, a roll-to-roll adhesion between the copper foil and the insulating layer is achieved.
  3. Customizable
    – Both the thickness of the copper foil and the resin can be customized, and the resin can be selected to match the insulating material to be applied.

Product Specification

ApplicationCompositionDkDf
For FPCCopper foil 122.670.002
Resin 6
For PCBCopper foil 182.830.002
Resin 3
*Measured under conditions (23℃/50%)

Inquiries on This Product

ZACROS Taiwan Sales Dep.
Tel:07-6955966 #2150~2159

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