
Product Application
Product Application
5G-related Material

In recent years, the fifth-generation mobile communication system (5G) has received significant attention. This is due to being able to achieve communication speeds that are 5 to 10 times faster than traditional systems by using high-frequency millimeter waves.
With the advent of 5G’s high-capacity, high-speed communication, various materials are currently being developed to achieve the implementation of a smart society, represented by self-driving cars and remote medical care.

Product Description
Low-dielectric adhesive copper foil: ZAC-LDC
A resin coating with low transmission loss/thermosetting adhesive is applied on a low-profile copper foil. This greatly contributes to improving the performance of 5G wiring boards.
Product Features
- Uses low-profile copper foil
– The resin is designed to maintain good adhesion even when using low-profile copper foil. - Easy lamination
– Due to the adhesive resin, a roll-to-roll adhesion between the copper foil and the insulating layer is achieved. - Customizable
– Both the thickness of the copper foil and the resin can be customized, and the resin can be selected to match the insulating material to be applied.
Product Specification
Application | Composition | Dk | Df |
For FPC | Copper foil 12 | 2.67 | 0.002 |
Resin 6 | |||
For PCB | Copper foil 18 | 2.83 | 0.002 |
Resin 3 | |||
*Measured under conditions (23℃/50%) |
Inquiries on This Product
ZACROS Taiwan Sales Dep.
Tel:07-6955966 #2150~2159